TVS Diode Array SPA Diodes 2017 by Littelfuse

More catalogs by Littelfuse | TVS Diode Array SPA Diodes 2017 | 215 pages | 2017-11-12

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TVS Diode Array SPA Diodes 2017 is listed under these categories

Industrial Supply > Electrical & Test > Electronic Components

Featured catalog pages of TVS Diode Array SPA Diodes 2017

tvs diode arrays spa® diodes data protocol application and product selection for additional information including reference design examples please visit www.littelfuse.com/spa product series and applicable data rates and protocols data rate mbit/sec 0 .03 .05 audio data protocols .13 2 12 rs232 ieee 1284 usb 1.1 25 125 rs485 ethernet video 320 400 480 800 3,000 5,000 usb 2.0 ieee1394b sata hdmi/usb3.0 ieee 1394a lcds sp05 sp1001 sp1003 sp1005 sp1006 sp1006 sp1010 sp1011 sp1002 sp1004 sp1007 slvu2.8 slvu2.8-4 sp03-3.3 lc03-3.3 sp03-6 sp720 thru sp725 sp4040 sp4060 sp4061 sp4062 srv05 sp3002 sp3004 sp3031 sp3010 sp3011 sp3012 sp3021 sp3030 sp3001 sp3003 typical applications speaker serial port com microphone keyboard audio headset mouse dc power bus set top box com keypad vcr buttons video in/out parallel port lpt printer scanner coputer input network hardware and periperal control system pci adapter devices hub router pda pmp webswitch cell phone cable/xdsl modem digital camera

tvs diode arrays spa® diodes general purpose esd protection sp721 series soldering parameters pb – free assembly pre heat temperature min tsmin 150°c temperature max tsmax 200°c time min to max ts 60 – 180 secs average ramp up rate liquidus temp tl to peak 5°c/second max tsmax to tl ramp-up rate 5°c/second max reflow temperature tl liquidus 217°c temperature tl 60 – 150 seconds 260+0 5 °c time within 5°c of actual peak temperature tp 20 – 40 seconds ramp-down rate 5°c/second max time 25°c to peak temperature tp 8 minutes max do not exceed 260°c critical zone tl to tp ramp-up tl tsmax tl ramp-do ramp-down preheat tsmin 25 peak temperature tp tp tp temperature reflow condition ts time to peak temperature time package dimensions — dual-in-line plastic packages pdip n e1 index area 1 2 3 n/2 package pdip pins 8 lead dual-in-line jedec -bd e base plane -c seating plane a2 a l d1 e b1 d1 b cl ea a1 ec 0.010 0.25

tvs diode arrays spa® diodes general purpose esd protection sp05 series absolute maximum ratings parameter storage temperature range package power dissipation sc70 sot23-3 sot23-5 sot23-6 sot143 msop electrical characteristics rating –40 to 125 units ºc 0.2 0.225 0.5 w w w ta +25ºc unless otherwise specified parameter test conditions min reverse standoff voltage ir ≤ 1μa reverse standoff leakage current v 5.0v typ max units 5.5 v 1 100 na 8.5 v -0.8 -0.4 v signal clamp voltage positive i 1ma 6.0 negative i 10ma -1.2 clamp voltage during esd mil-std-883 method 3015 hbm test 8kv 12 v 8kv -8 v esd test level 1 iec-61000-4-2 contact discharge 30 mil-std-883 method 3015 hbm kv 30 capacitance 2.5v 1mhz turn on/off time kv 30 pf <1 ns temperature range operating -40 85 ºc storage -65 150 ºc diode dynamic resistance forward conduction 1.0 Ω reverse conduction 1.4 Ω note 1 esd voltage applied between channel pins and ground one pin at a time all

tvs diode arrays spa® diodes general purpose esd protection sp1003 series transmission line pulsing tlp plot leakage vs temperature 35.0 20 18 30.0 leakage current na tlp current a 16 14 12 10 8 6 4 2 0 25.0 20.0 15.0 10.0 5.0 0 2 4 6 8 10 12 14 16 18 0.0 0 tlp voltage v 10 20 30 40 50 temperature ºc pulse waveform 110 100 90 percent of ipp 80 70 60 50 40 30 20 10 0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time μs soldering parameters pre heat pb – free assembly temperature min tsmin 150°c temperature max tsmax 200°c time min to max ts 60 – 180 secs average ramp up rate liquidus temp tl to peak 3°c/second max tsmax to tl ramp-up rate 3°c/second max reflow temperature tl liquidus 217°c temperature tl 60 – 150 seconds peak temperature tp 260+0 5 °c time within 5°c of actual peak temperature tp 20 – 40 seconds ramp-down rate 6°c/second max time 25°c to peak temperature tp 8 minutes max do not exceed 260°c © 2017

tvs diode arrays spa® diodes general purpose esd protection sp1008 series sp1008 series 6pf 15kv bidirectional discrete tvs protection rohs pb green description the sp1008 includes back-to-back tvs diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges esd these robust diodes can safely absorb repetitive esd strikes above the maximum level specified in the iec 61000-4-2 international standard ±15kv contact discharge without performance degradation the back-to-back configuration provides symmetrical esd protection for data lines when ac signals are present pinout features 1 • rohs compliant halogen-free and leadfree 2 • esd iec 61000-4-2 ±15kv contact ±15kv air • eft iec 61000-4-4 40a 5/50ns note drawing not to scale 2 • space efficient 0201 footprint applications additional information datasheet • low leakage current of 0.1μa

tvs diode arrays spa® diodes low capacitance esd protection sp3002 series thermal information absolute maximum ratings symbol parameter value units ipp peak current tp=8/20μs 4.5 a top operating temperature –40 to 125 °c tstor storage temperature –55 to 150 °c caution stresses above those listed in “absolute maximum ratings” may cause permanent damage to the device this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied parameter rating units storage temperature range –55 to 150 °c maximum junction temperature 150 °c maximum lead temperature soldering 20-40s 260 °c electrical characteristics top=25ºc symbol test conditions max units reverse standoff voltage parameter vrwm ir ≤ 1µa 6.0 v reverse leakage current ileak vr=5v 0.5 µa clamp voltage1 vc esd withstand voltage1 vesd diode capacitance1

tvs diode arrays spa® diodes low capacitance esd protection sp3010 series absolute maximum ratings symbol parameter value ipp peak current tp=8/20μs top tstor units 3.0 a operating temperature –40 to 125 °c storage temperature –55 to 150 °c caution stresses above those listed in “absolute maximum ratings” may cause permanent damage to the device this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied electrical characteristics top=25ºc symbol test conditions reverse standoff voltage parameter vrwm ir ≤ 1µa reverse leakage current ileak clamp voltage1 vc dynamic resistance max units 6.0 v 0.5 µa vr=5v any i/o to gnd 0.1 10.8 v ipp=2a tp=8/20µs fwd 12.3 v vc2 vc1 ipp2 ipp1 vesd diode capacitance1 typ ipp=1a tp=8/20µs fwd rdyn esd withstand voltage1 min 1.5 iec61000-4-2 contact ±8 iec61000-4-2 air ±15

tvs diode arrays spa® diodes low capacitance esd protection sp3021 series product characteristics ordering information lead plating pre-plated frame or matte tin lead material copper alloy lead coplanarity 0.0004 inches 0.102mm substitute material silicon body material molded epoxy flammability ul 94 v-0 part number package sp3021-01etg sod882 • marking min order qty 12000 notes 1 all dimensions are in millimeters 2 dimensions include solder plating 3 dimensions are exclusive of mold flash metal burr 4 blo is facing up for mold and facing down for trim/form i.e reverse trim/form 5 package surface matte finish vdi 11-13 soldering parameters pre heat pb – free assembly temperature min tsmin 150°c temperature max tsmax 200°c time min to max ts 60 – 180 secs average ramp up rate liquidus temp tl to peak 3°c/second max tsmax to tl ramp-up rate 3°c/second max reflow temperature tl liquidus 217°c temperature tl 60 – 150 seconds peak

tvs diode arrays spa® diodes lightning surge protection sp2504n series package dimensions — µdfn-10 top view package a d µdfn-10 2.6x2.6mm jedec mo-229 millimeters symbol e a min nom max min nom max 0.45 0.50 0.55 0.018 0.020 0.022 0.130 ref a3 b side view 0.10 c 0.17 0.22 0.27 0.006 0.008 0.010 d 2.50 2.60 2.70 0.097 0.101 0.105 0.085 d2 2.10 2.15 2.20 0.081 0.083 e 2.50 2.60 2.70 0.097 0.101 0.105 e2 1.21 1.26 1.31 0.046 0.049 0.051 0.45 0.014 0.50 bsc 0.35 l a seating plane 0.005 ref b e a3 inches 0.020 bsc 0.40 0.016 0.018 recommended solder pads µdfn-10l 2.6x2.6mm 0.05 c c b 0.10 mcbabz bottom view d2 fgcy 2x c x p dimension symbol millimeters inches b 2.30 0.091 c 2.20 0.087 f 1.41 0.056 g 1.65 0.065 p 0.50 0.020 x 0.37 0.015 y 0.55 0.022 z 2.75 0.108 e2 e embossed carrier tape reel specification — µdfn-10 2.6x2.6mm p0 p2 p1 reel size:7 inches d0 e a0 ftwd1 k0 b0 pin 1 location user feeding direction 5º max 5º max symbol millimeters a0 2.82

tvs diode arrays spa® diodes diodes lightning surge protection sp2502l series package dimensions — mechanical drawings and recommended solder pad outline package lf soic pins 8 jedec ms-012 millimetres o recommended soldering pad outline reference only inches min max min max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 a2 1.25 1.65 0.050 0.065 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 d 4.80 5.00 0.189 0.197 e 5.80 6.20 0.228 0.244 e1 3.80 4.00 0.150 0.157 1.27 bsc e l 0.050 bsc 1.27 0.40 0.050 0.016 embossed carrier tape reel specification — soic package millimetres user feeding direction e pin 1 location inches min max min max 1.65 1.85 0.065 0.073 f 5.4 5.6 0.213 0.22 p2 1.95 2.05 0.077 0.081 d 1.5 1.6 0.059 0.063 d1 p0 10p0 1.50 min 3.9 4.1 40.0 ± 0.20 0.059 min 0.154 0.161 1.574 ± 0.008 w 11.9 12.1 0.468 0.476 p 7.9 8.1 0.311 0.319 a0 6.3 6.5 0.248 0.256 b0 5.1 5.3 0.2 0.209 k0 2 2.2 0.079 0.087 t 0.30 ± 0.05 0.012 ± 0.002 disclaimer

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