Page 29 of Ceramic Filters "CERAFIL" for Communication Equipment by Murata Manufacturing Co.,Ltd.

!note · this pdf catalog is downloadedand !caution formurata manufacturing co ltd therefore it s specifications are subject to change or our products in it may be discontinued without advance notice please check with our !note · please read rating from the website of storage operating rating soldering mounting and handling in this catalog to prevent smoking and/or burning etc sales representatives or product engineers before ordering · this catalog has only typical specifications because there is no space for detailed specifications therefore please approve our product specifications or transact the approval sheet for product specifications before ordering · this pdf catalog has only typical specifications because there is no space for detailed specifications therefore please approve our product specifications or transact the approval sheet for product specifications before ordering p05e.pdf 06.2.13 mhz smd type cerafilr notice continued from the preceding page s sfecf10m7 series notice handling 1 the component will be damaged when an excessive stress is applied 2 the component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board 3 design layout of components on the pc board to minimize the stress imposed on the warp or flexure of the board 4 after installing chips if solder is excessively applied to the circuit board mechanical stress will cause destruction resistance characteristics to lower to prevent this be extremely careful in determining shape and dimension before designing the circuit board diagram 5 the component may be damaged during mounting process if some part of mounter such as positioning claws nozzle are worn down the regular maintenance recommended for mounters should be done to prevent the troubles 6 the component is recommended with placement machines which employ optical placement capabilities the component might be damaged by excessive mechanical force please make sure that you have evaluated by using placement machines before going into mass production do not use placement machines which utilize mechanical positioning please contact murata for details beforehand 7 when correcting chips with a soldering iron the tip of the soldering iron should not directly touch the chip component depending on the soldering conditions the effective area of terminations may be reduced the use of solder containing ag should be done to prevent the electrode erosion 8 do not clean or wash the component as it is not hermetically sealed 9 in case of covering filter with over coat conditions such as material of resin cure temperature and so on should be evaluated carefully 10 do not use strong acidity flux more than 0.2wt chlorine content in re-flow soldering 11 accurate test circuit values are required to measure electrical characteristics it may be a cause of miscorrelation if there is any deviation especially stray capacitance from the test circuit in the specification 12 the components packed in the moisture proof bag dry pack are sensitive to moisture the following treatment is required before applying re-flow soldering to avoid reliability degradation caused by thermal stress when unpacked store the component in an atmosphere at 30°c and below 60%r.h and solder within 1 week 13 for safety purposes connect the output of filters to the if amplifier through a d.c blocking capacitor avoid applying a direct current to the output of ceramic filters [component layout close to board perforation b a slit c susceptibility to stress is in the order of a>c>b 9 continued on the following page 28

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