Thin Film Metalized Substrate by Murata Manufacturing Co.,Ltd.

More catalogs by Murata Manufacturing Co.,Ltd. | Thin Film Metalized Substrate | 5 pages | 2006-11-27

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Murata Manufacturing Co.,Ltd., Thin Film Metalized

!note please read rating and !caution for storage operating rating soldering mounting and handling in this pdf catalog to prevent smoking and/or burning etc this catalog has only typical specifications therefore you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering m04e.pdf 05.9.6 thin film metalized substrate ru series features 1 low insertion loss for using high q-value dielectric substrate 2 a wide selection of substrate material to meet your needs 3 excellent reliability for developing suitable film structure 4 for compatibility with gold electrodes die bonding with ausn and wire bonding with gold wire are possible 5 precise microscopic pattern will be available by thin film microfabrication technology 6 through via hole ausn pre-coating and other process are available 7 cr complex product will be available when combining a capacitor by a high dielectric substrate and a thin film resistor resistor pic 1

!note please read rating and !caution for storage operating rating soldering mounting and handling in this pdf catalog to prevent smoking and/or burning etc this catalog has only typical specifications therefore you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering m04e.pdf 05.9.6 practical correspondent scope of resistor table 2 practical correspondent scope of resistor material sheet resistance operating temperature range [°c rated power [mw/mm resistance tolerance resistance temperature coefficient [ppm/°c 2 tan 12.5 25 50 ­55 to +125 100 t20 ­70t50 please contact us for other tolerance than indicated above practical correspondent scope of through via hole table 3 practical correspondent scope of through via hole a hole space [mm b distance between hole and electrode [mm c distance between electrode and chip edge [mm 0.22 min 0.10 min 0.15 min hole diameter ø0.1 to ø0.3mm when t=0.38mm or

!note please read rating and !caution for storage operating rating soldering mounting and handling in this pdf catalog to prevent smoking and/or burning etc this catalog has only typical specifications therefore you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering m04e.pdf 05.9.6 notice notice storage and operating condition note the following to prevent poor die bonding and poor wire bonding 1 store the capacitors in manufacturer s package in the following conditions without a rapid thermal change in an indoor room · temperature -10 to 40°c · humidity 30 to 70%rh 2 avoid storing the capacitors in the following conditions a ambient air containing corrosive gas chlorine gas hydrogen sulfide gas ammonia gas sulfuric acid gas nitric oxide gas etc b ambient air containing volatile or combustible gas c in environments with high concentration of airborne particles d in liquid water oil chemical solution

!note please read rating and !caution for storage operating rating soldering mounting and handling in this pdf catalog to prevent smoking and/or burning etc this catalog has only typical specifications therefore you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering m04e.pdf 05.9.6 note 1 export control for customers outside japan murata products should not be used or sold for use in the development production stockpiling or utilization of any conventional weapons or mass-destructive weapons nuclear weapons chemical or biological weapons or missiles or any other weapons for customers in japan for products which are controlled items subject to the foreign exchange and foreign trade law of japan the export license specified by the law is required for export 2 please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below which