Bonding Capillaries Bonding Evolution 2018 by SPT - Small Precision Tools

More catalogs by SPT - Small Precision Tools | Bonding Capillaries Bonding Evolution 2018 | 41 pages | 2018-02-19

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creative solutions research development customer partnership customer partnership is our belief at spt we listen to our customers because every customer’s needs are different every solution is uniquely designed to satisfy those needs in the most effective way spt offers a wide range of proactive support and services such as consulting design analysis training seminars and benchmarking partnerships spt’s material and process technology laboratories in switzerland and singapore offer technical support and services such as material analysis process evaluation and characterization and tool design optimization research development design

content » click title to go to page 9 introduction 10 ceramic injection molding cim 11 gold ball wire bonding process 12 copper wire bonding process 13 gold copper wire bonding cycle 15 capillary designs solutions capillary part number selection guide 16 basic capillary design rule 19 ball bond 21 stitch bond 23 capillary designs solutions to fit specific bonding application determine shank style 25 capillary designs solutions to fit specific bonding application capillary tip surface finish selection 26 capillary designs solutions to fit specific bonding application capillary material az alumina zirconia capillary material extended tool life for gold wire infinity capillary 27 capillary designs solutions to fit specific bonding application capillary material azr alumina zirconia ruby 28 how to order fine pitch series 29 how to order non fine pitch series 30 stud ball bumping sbb 31 special capillary taper design accessories 32

copper wire bonding process wire bonding process is commonly used to interconnect chips to the outside world using gold wire since its inception in the mid 1950 using thermo-compression an application of heat and force however it was not enough to form a more reliable oxide free ball and stitch bonds interface until the introduction of thermosonic bonding in 1960 incorporates ultrasonic energy for decades continuous progression to improve the device-package reliability has been the primary goal while cost of ownership has become one of the driving forces to make all the electronic gadgets available nowadays affordable to the masses in general the copper wire bonding process is very similar with gold wire bonding as it basically uses the same wire bonder equipment with minor hardware and software retrofits instead of gold wire it is replaced by copper wire though not limited the range is typically from 15µm to 50µm in wire diameters depending upon the package-device application

basic capillary design rules as the semiconductor industry braced itself for the transition from gold to copper the copper wire conversion is relatively a tougher process to define as compared to gold wire bonding with challenges both on the ball bond and stitch bond the problem the customer may face varies depending on the bond pad metallization structure and the substrate or lead frame surface condition one of the basic principles to achieve an optimized wire bonding process is through proper capillary design selection the synergy of different process variables coming from the wire e.g gold and copper substrate or lead frame based metallization bond pad metallization and wire bonder are influential to the final geometrical design of the capillary the proper selection of the copper wire bare or coated and capillary type are critical to resolve wire bonding issues like excessive aluminium splashed out short tail or fish tail which are inherent problems related to copper wire bonding

ball bond in ultra-fine pitch ball bonding the consistency of the mashed ball diameter mbd looping and stitch bonds are essentially required in order to define a robust process the following considerations are important to produce a consistent mbd 1 consistent and symmetrical free-air-ball fab is important to produce a consistent mbd consistent and symmetrical fab unsymmetrical fab unsymmetrical mbd from unsymmetrical fab 2 correct capillary design considering the hole size chamfer diameter chamfer angle wire diameter targeted mbd and mashed ball height mbh wd h volfab volmb mbh cd mbd fabØ ca fabس 1.5h²h-wd cd³-h³ 4tan0.5ca 1.5mbd²mbh 3 controlled impact or initial force is needed for better control and consistent ball height force mn low impact force us ultrasonic time msec uncontrolled mbd mbh due too high impact force back to content

capillary shank styles selection to fit specific bonding application with the rapid changes in the assembly and packaging technology requirements new packaging solutions are being introduced in response to the demand for smaller thinner lighter and high performance multifunctional electronic products the emerging global semiconductor assembly’s direction to convert from gold to copper has added new sets of challenges to bond various types of packages such as ultra-fine pitch stacked die multi-tier low-k and fine-pitch in compliant with these new bonding requirements spt has developed a wide range of new capillary designs for a given specific application which is generally classified as follows shank style capillary tip finishing and material solution for advanced bonding application programmed intelligence pi capillary pi capillary unique geometrical design is a popularly used for devices such as low-k fine -pitch application and advanced packaging which require

extended tool life for copper wire alumina zirconia ruby azr the conversion of gold-to-copper wire has been successfully implemented from simple to complex device-package combinations for leaded e.g soic qfp qfn and laminates ranging from lowto-high pin counts embracing the economic benefits of using copper wire interconnect to compete in the electronic consumer driven market the semiconductor assembly companies are constantly searching for methods to reduce the cost of ownership and one of which is through cost per number of touchdowns from the capillary physical and mechanical properties of azr color hardness hv1 grain size µm density g/cm³ composition pink 2050 <0.9 4.25 al²o³ zro² cr²o³ the azr microstructure figure 1 is made of high purity fine-grained homogenous alumina zirconia with chromium oxide totally dissolved in the matrix a highly dense material with excellent hardness which is most suitable for rugged metallization terrain used for copper bonding

stud ball bumping sbb with continuous die size shrinkage and finer bond pad pitches of less than 60um this solder bumping process is expected to be the future option for packaging technology miniaturization for csp flip chip application solder bumping of wafer are done either by electroplating method to form the 63sn37pb solder balls and the other method is by gold au ball bonds formed on the aluminum bond pad al by a conventional wire bonder special designed capillary is needed to meet the different bond pad pitches the general design rule on the desired mashed ball mbd given the bond pad opening still applies however since there is no looping the capillary with 20 deg main taper angle mta is one of the design features useable wire diameter µm h µm cd µm fa ° t µm recommended spt part number 100 30 35 55 0 130 sbb-35130-558a-zp34 90 25 30 53 0 110 sbb-30110-538a-zp34 80 25 30 51 0 100 sbb-30100-518a-zp34 70 25 30 48 0 90 sbb-30090-488a-zp34 bond pad pitch µm back to

accessories for wire bonding process efo wands the importance of consistent free air ball fab for finepitch fp and ultra-fine pitch ufp bonding applications has led to the development of new alloy material to improve the performance of the efo wand together with a new proprietary process consistent efo sparking effect can be achieved with spt efo wands spt is capable of making customized efo wands used on different types of bonder with precise dimensions and accuracy fab formation during wire bonding process when a new efo wand is installed for the first time on the bonder inconsistent sparking normally occurs causing inconsistent fab formation it can be also noticed that the spark direction during firing tends to sway to the left or right during the initial sparks this has the tendency to produce a tilted fab as shown this effect is mainly due to the inability of the new efo wand to lead the current to flow from the same point tilted fab effect of the tilted fab consistent firing of

capillary wire bonding tools requirement checklist spt roth ltd switzerland e-mail info-ch@spt.net fax 41 32 387 80 88 small precision tools inc california usa e-mail info-usa@spt.net fax +1 707 559 2072 customer date department contact no company order taken by extn spt asia pte ltd singapore e-mail info-sg@spt.net fax +65 6250 2725 small precision tools phil corp philippines e-mail info-ph@spt.net fax +632 531-5780 small precision tools co ltd china e-mail info-cn@spt.net fax +86 510 8516 5233 spt japan co ltd japan e-mail info-jp@spt.net fax +81 45 470 6755 application lead count wire diameter bonder model bond pad size pad pitch loop height target mashed ball diameter bond pad metallization distance between pad to lead lead width lead pitch lead metallization bonding temperature ultrasonic bonding frequency present capillary part numbers wire bonding top 3 defects any other wire bonding problems recommended spt capillary part no back to