Bonding Capillaries Bonding Evolution 2018 by SPT - Small Precision Tools

More catalogs by SPT - Small Precision Tools | Bonding Capillaries Bonding Evolution 2018 | 41 pages | 2018-02-19

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Page 18 of Bonding Capillaries Bonding Evolution 2018

basic capillary design rules  chamfer angle ca provides a certain amount of squash out in the formation of mbd it also controls free air ball fab centering during its impact.typical chamfer angle is 90° inner chamfer grips the initial free air ball during the transfer of ultrasonic energy smaller ca smaller mbd mbd bigger ca bigger mbd mbd cd ca 70° cd ca 120° the combination and interaction of the hole size chamfer diameter chamfer angle and inner chamfer determines the total amount of volume necessary to form the ball bond the total volume of the fab must be greater than the volume created by the above combination so that enough gold or copper material is squashed out of the chamfer area to form the desired mbd fab centering resultant from us transfer typical capillary hole size selection based on wire diameter the proper selection of hole size for a given wire diameter is vital in the design of the capillary this applies not only for fine pitch application but also for standard designs table 1 summarizes the recommended combination which would provide better control and consistent looping profile given wire diameter in µm inch hole size in µm inch 12 .0005 15 .0006 18 .0007 20 .0008 23 .0009 25 .0010 28 .0011 30 .0012 33 .0013 38 .0015 51 .0020 64 .0025 75 .0030 100 .0039 127 .0050 15 .0006 16 .00063 18 .0007 – 21 .0008 21 .0008 – 25 .0010 25 .0010 – 28 .0011 28 .0011 – 30 .0012 33 .0013 – 38 .0015 35 .0014 – 38 .0015 38 .0015 – 41 .0016 43 .0017 – 46 .0018 51 .0020 – 56 .0022 64 .0025 – 68 .0027 75 .0030 – 90 .0035 90 .0035 – 100 .0039 127 .0050 178 .0070 table 1 back to content 18