Bonding Capillaries Bonding Evolution 2018 by SPT - Small Precision Tools

More catalogs by SPT - Small Precision Tools | Bonding Capillaries Bonding Evolution 2018 | 41 pages | 2018-02-19

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Page 30 of Bonding Capillaries Bonding Evolution 2018

stud ball bumping sbb with continuous die size shrinkage and finer bond pad pitches of less than 60um this solder bumping process is expected to be the future option for packaging technology miniaturization for csp flip chip application solder bumping of wafer are done either by electroplating method to form the 63sn37pb solder balls and the other method is by gold au ball bonds formed on the aluminum bond pad al by a conventional wire bonder special designed capillary is needed to meet the different bond pad pitches the general design rule on the desired mashed ball mbd given the bond pad opening still applies however since there is no looping the capillary with 20 deg main taper angle mta is one of the design features useable wire diameter µm h µm cd µm fa ° t µm recommended spt part number 100 30 35 55 0 130 sbb-35130-558a-zp34 90 25 30 53 0 110 sbb-30110-538a-zp34 80 25 30 51 0 100 sbb-30100-518a-zp34 70 25 30 48 0 90 sbb-30090-488a-zp34 bond pad pitch µm back to content 30