Wedges for Gold and Aluminum Bonding Rev3 2018 by SPT - Small Precision Tools

More catalogs by SPT - Small Precision Tools | Wedges for Gold and Aluminum Bonding Rev3 2018 | 39 pages | 2018-02-19

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Wedges for Gold and Aluminum Bonding Rev3 2018 is listed under these categories

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product technology excellence unsurpassed spt positions itself as a progressive high-technology tool manufacturer using state-of-the art processes our production capabilities range from conventional to cnc machining including milling turning surface grinding honing electro-discharge machining or edm jig grinding and more our exclusive injection molding technology of small complex parts through spt’s own in-house formulation and sintering assures customers of the highest quality in high alumina ceramic and carbide materials our equipment and manufacturing techniques are the most advanced in the ultra precision tool industry we make standard and custom designs for specific customer requirements all bonding capillary µbga tab tool fine pitch bonding wedge waffle tab tool die attach collets bushings precision parts cim mim parts watch

process development and optimization the failure during pull test may occur at one of the five positions in the wire-bond structure the key stages generally include initial process design and development process characterization process control and process optimization these stages form a continuous loop between characterization and control with periodic optimization and development a lift off first bond in the initial stages of the process process capabilities should be known to set achievable goals the second stage process characterization is to collect and categorize the data on wire-bonding failures such as bond off center bond not sticking on die wire breaking and so on process control the third stage is important for a successful process to achieve a stable performance the operating variables such as bond program parameters machine setup operation procedures bonding tool installation wire pull procedures and product change must be minimized and consistent across the process such

us/ut series universal bonding tool ba 20° fa Øh style ha w fr bf wire feed angle ut30a us30a ut38a 30° 38° us38a ut30c us30c 30° ut38c us38c 38° ut45a us45a ut45c us45c 45° 45° 12 hole bond flat hole h in µm ±.0002/5 bond flat bf in µm ±.0002/5 t ut has a 10° ba us has a slimline 0° ba foot width w in µm ±.0002/5 us 0° back angle ut 10° back angle 30° 38° 45° ra br radius set wire material wire diameter hole size fr ± .0001/3 br ± .0001/3 a aluminum .0010 25 .0013 33 .0020/51 .0025/64 .0010 25 .0010 25 a aluminum .0013 33 .0015 38 .0030 76 .0015 38 .0015 38 a aluminum .0015 38 .0022 56 .0035 89 .0020 51 .0020 51 a aluminum .0024 61 .0030 76 .0045 114 .0025 64 .0025 64 c aluminum/gold .0008 20 .0013 33 .0020 51 .0010 25 .0006 15 ew standard dimensions tool styles radius set feed angle tip thickness t 55°/60° in µm ±.0005/13 useable wire diameter in µm hole bond

standard notch bonding tools general guidelines on how to order the standard 10º back bonding wedge is designed for use with aluminum wire in all conventional manual bonding machines the notched tip minimizes wire drag during the looping formation preventing heel cracks and broken wires style 30° 1001 1002 60° c ha fr cd w concave standard ra m br bf t 1001 ha 30° fa 45° ra 15° 1002 ha 45° fa 45° ra 15° 1110 ha 60° fa 30° ra 20° hole bond flat material fa Øh w flat optional 45° standard 10° back 1110 20° 20° feed angle cermet composite for gold wire recommended for low temperature bonding will rely on specific application requirements wire diameter used bond pad size – see dimension table microloy osmium-carbide alloy for gold aluminum wire for oval hole options please specify hh hole height hw hole width ti titanium carbide composite for gold wire w tungsten carbide ultra fine grain for aluminum wire tool length

special bonding tools special bonding tools general guidelines on how to order style insulated wire bonding wedge standard 10° back material gd gr g go w xgr insulated wire bonding wedge cgd cgr c cgo fl m cermet composite for gold wire recommended for low temperature bonding foot length will rely on specific application requirements wire diameter used bond pad size – see dimension table microloy osmium-carbide alloy for gold aluminum wire ti titanium carbide composite for gold wire w tungsten carbide ultra fine grain for aluminum wire tool length tl s .437 11.1 mm ¾ .750 19.05 mm l .828 21.0 mm 1.00 1.00 25.4 mm longer lengths are available consult bonder manufacturer for specifications foot options m matte finish on tip standard dimensions tool styles foot length fl foot width w in µm ±.0002/5 in µm ±.0002/5 groove depth cross groove depth gd cgd in µm ±.0001/3 groove radius cross groove radius gr /cgr in µm ref how to order groove

inline groove no-hole tools inline groove no-hole tools general guidelines on how to order osg7 style style osg7 wire size specify wire size 70° deep “v” groove material w tungsten carbide ultra fine grain for aluminum wire 10° typ 30° tool dia td in mm ±.0001”/3µm 1/8 .1249 3.172 70° tdf in mm ±.0005”/13µm .110 2.794 specified length tl in mm ±.005”/130µm 2.50 2.500 63.50 gd foot options br fr b fl w g the fr and br are polished and a fine matte finish is within the area of the groove standard gm the fr br and groove have a matte finish standard dimensions useable wire diameter wd in µm foot length fl in µm ±.0005/13 front radius fr in µm ref back radius br in µm ref foot width w in µm ±.0005/13 groove depth gd in µm min groove opening b in µm ±.0003/8 osg7 4 .0040 100 .0114 290 .0027 69 .0054 137 .0080 200 .0027 69 .0046 117 osg7 5 .0050 125 .0142 361 .0034 86 .0068

inline groove autobonding tools inline groove autobonding tools general guidelines on how to order 45ck style style 20° 45ck feed angle 45° inline and 70° “v” groove 60° wire feed available with slimline 45° Øh wire size material w specify wire size 45° tungsten carbide ultra fine grain for aluminum wire 70° b fr w br fl useable wire diameter wd in µm hole diameter in µm ±.0005/13 foot length fl in µm ±.0005/13 front/back radius fr br in µm ref foot width w in µm ±.0005/13 tip length t in µm ±.0010/25 groove depth gd in µm min .0030 75 .0055 140 .0070 178 .0015 38 .0070 178 .0270 686 .0018 46 .0032 81 45ck-100 .0040 100 .0059 150 .0073 185 .0020 51 .0079 200 .0290 737 .0026 65 .0043 110 45ck-125 .0050 125 .0074 188 .0086 219 .0025 64 .0098 250 .0340 864 .0032 81 .0054 137 45ck-150 .0060 150 .0089 226 .0100 254 .0030 76 .0118 300 .0400 1016 .0038 97 .0065 165 45ck-175 .0070

inline groove notch tools inline groove notch tools general guidelines on how to order 1015a 2015a 1016a 2016a style style 10° 20° Øh gr 60° gd b gr go fr f fl u groove 1016a 2016a useable wire diameter wd in µm .0030 75 hole diameter h in µm ±.0005/13 foot length fl in µm ±.0005/13 front radius fr in µm ±.0005/13 back radius br in µm ±.0005/13 2015a wire size material w ha 30° ha 45° flat foot width clearance tip length f in µm ref w in µm ±.0005/13 c in µm ref t in µm ±.0010/25 groove depth gd in µm ±.0002/5 tool dia td in mm ±.0001”/3µm 1/16 .0624 1.585 .0570 1.448 1/8 .1249 3.172 .0937 2.378 2mm .0785 1.995 3mm .1180 2.997 groove opening go in µm ±.0005/13 .0050 125 .0075 191 .0150 381 .0030 76 .0030 76 .0110 279 .0125 318 .0040 102 .0450 1143 .0015 38 .0053 135 tdf in mm ±.0005”/13µm specified length tl in mm ±.005”/130µm 3/4

single point-tab bonding tools single point-tab bonding tools nearly every desktop computer and server in use today contains one or more hard-disk drives every mainframe and supercomputer is normally connected to hundreds of them you can even find vcrtype devices portable music players such as mp3 devices and camcorders that use hard disks instead of tape these billions of hard disks do one thing well-they store changing digital information in a relatively permanent form they give computers the ability to remember things when the power goes out advancement in technology has lead to the increase in the storage capacity of the hard disk drive the evolution towards a smaller slider has challenged the head-gimbal assembly hga and head stack assembly hsa processes for new bonding techniques flexible traces are rapidly replacing wires in the disk drive industry these traces can be bonded with various tip designs these bonding tools have been develop by spt by using a new innovative molding

waffle foot single point-tab tools small wire shank style vertical hole shank v style j style h style p style 7045w waffle tip abcde no flat .0590±.0005 in [1.499±0.013 mm some wedge bonders position the wire clamp mechanisms above the tool in order to accommodate deep access or tight clearance packages by moving the clamps above the tool you can bond closer to the sides of the package or other devices tool style tool style with vertical hole the tool itself has a hole running down the center exiting above the wire feed hole the angle of the wire feed is usually 45deg or 55deg in order to minimize the bending of the wire ut fp cob m rw abt vu vf vc vm vr va tool style tool style with vertical hole special clearance ut fp cob m rw abt ju jf jc jm jr ja tool style tool style with vertical hole ut fp cob m rw abt hu hf hc hm hr ha tool style tool style with vertical hole ut fp cob m rw abt pu pf pc pm pr pa note for delvotec bonders specify vbl 060 how to order the vertical hole

notes revised 3/10-5 spt roth ltd werkstrasse 28 ch-3250 lyss switzerland tel +41 32 387 80 80 fax +41 32 387 80 88 e-mail info-ch@spt.net small precision tools inc 1330 clegg street petaluma ca 94954 usa tel +1 707 765 4545 fax +1 707 778 2271 e-mail info-usa@spt.net spt asia pte ltd 970 toa payoh north #07-25/26 singapore 318992 tel +65 6253 5577 fax +65 6250 2725 e-mail info-sg@spt.net small precision tools phil corp 35 libertad street mandaluyong city 1550 philippines tel +632 533-7067 fax +632 531-5780 e-mail info-ph@spt.net small precision tools co ltd a2 building liyuan economic development zone wuxi jiangsu p.r.china 214072 tel +86-510-8516 1968 fax +86-510-8516 5233 e-mail info-cn@spt.net spt japan co ltd 901 2-5-2 shin-yokohama kohoku-ku yokohama-shi kanagawa 222-0033 tel +81-45-470-6288 fax +81-45-470-6755 e-mail info-jp@spt.net www.spt.net