3 search results for bond clamp in 1.030 seconds found

Wedges for Gold and Aluminum Bonding Rev3 2018

break the wire while machine bonding force is maintained on the second bond clamp tear or the clamps remain stationary and the bonding tool raises off ... the ultrasonic bonding process typically started by feeding the wire at ... an angle usually 30-60° from the horizontal bonding surface through a hole in the back of a bonding ... wedge normally forward bonding is preferred i.e the first bond is made to the

Wedges for Gold and Aluminum Bonding Rev3 2018

bonding failures cratering typically occurring in ultrasonic bonding is defined as damage to the semiconductor glass or other layers that ... lie under the bonding pad metallization the damage may be in the form of a recognizable ... cause stacking faults to occur in the silicon lattice  too low bond force can induce cratering in wedge bonds causing the tool to bounce/

Wedges for Gold and Aluminum Bonding Rev3 2018

tip abcde no flat .0590±.0005 in [1.499±0.013 mm some wedge bonders position the wire clamp mechanisms above the tool in order to ... tight clearance packages by moving the clamps above the tool you can bond closer to the sides of the package or other devices tool style tool ... vertical hole ut fp cob m rw abt pu pf pc pm pr pa note for delvotec bonders specify vbl 060 how to order the vertical hole shank style can be