Encyclopedia of Thermal Packaging by World Scientific Publishing Co Pte Ltd

More catalogs by World Scientific Publishing Co Pte Ltd | Encyclopedia of Thermal Packaging | 4 pages | 2018-11-22

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Catalog Encyclopedia of Thermal Packaging

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Featured catalog pages of Encyclopedia of Thermal Packaging

recommend to your library for purchase connecting great minds encyclopedia of thermal packaging set 2 thermal packaging tools a 4-volume set edited by avram bar-cohen university of maryland usa look inside for more on set 1 thermal packaging techniques a 6-volume set ‘‘ the encyclopedia meets head-on the challenges engineers and researchers face in this era of information abundance by its breadth of coverage the encyclopedia provides a bird’s eye view of the techniques and approaches used over the entire field of electronics thermal management by its depth of coverage each volume provides the reader with a comprehensive guide to a specific subject area this is undoubtedly a milestone publication that will serve the industry and the research community for many years to come dr wataru nakayama volume 1 cooling of microelectronic and nanoelectronic equipment advances and emerging research madhusudan iyengar [facebook usa karl geisler [3m usa volume 3 compact thermal

encyclopedia of thermal packaging about the editor-in-chief dr avram bar-cohen is an internationally recognized leader in the development and application of thermal science and engineering to microelectronic and optoelectronic systems in his current role at the defense advanced projects agency darpa and through his professional service in ieee and asme he has helped to define and guide the development of thermal packaging science and technology and facilitated the emergence of high reliability consumer electronics computing platforms and microwave communication and radar systems his research and publications as well as short courses tutorials and keynote lectures on air-cooled card cages and heat sinks along with direct liquid cooling of microprocessors and rf components have helped to create the scientific foundation for the thermal management of micro and nano-electronic components and systems dr avram bar-cohen bar-cohen is an honorary member of asme and fellow of ieee as well as

encyclopedia of thermal packaging about the encyclopedia of thermal packaging thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization reliability and functional density achieved by electronic microelectronic and nanoelectronic products during the past 50 years the inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional as well as emerging electronic product categories successful thermal packaging is the key differentiator in electronic products as diverse as supercomputers and cell phones and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications the encyclopedia of thermal packaging compiled in four multi-volume sets set 1 thermal packaging

encyclopedia of thermal packaging set 1 thermal packaging techniques a 6-volume set 1580pp set 1 set 2 thermal packaging tools a 4-volume set 1580pp set 2 dec 2012 978-981-4313-78-0 us$1,580 £1,043 978-981-4313-79-7ebook us$2,054 £1,356 oct 2014 978-981-4327-60-2 978-981-4327-66-4ebook scan this code with your smartphone to go to our book’s webpage us$1,580 £1,043 us$2,054 £1,356 scan this code with your smartphone to go to our book’s webpage http www.worldscientific.com/worldscibooks/10.1142/7969 http www.worldscientific.com/worldscibooks/10.1142/7819 recommend to your library for purchase order form please complete the form and send it to any of our offices below or order online www.worldscientific.com alternatively you can send your order directly to your regular book supplier north south america europe the middle east asia the rest of the world world scientific publishing co inc 27 warren street suite 401-402 hackensack nj 07601 usa fax 1-201-487-9656